| P/N | Color | Thermal conductivity | Features and Applications. |
|---|---|---|---|
| STG-715 | White | 1.5W/mK Thermal grease | Heat dissipator and base plate connector, act as the caulk material between the heat source and heat dissipator. |
| STG-20D | White | 2.0W/mK Thermal grease | Heat dissipator and base plate connector, act as the caulk material between the heat source and heat dissipator. |
| STG-30D | grey | 3.0W/mK Thermal grease | Heat dissipator and base plate connector, act as the caulk material between the heat source and heat dissipator. |
| STG-40D | grey | 4.0W/mK Thermal grease | Heat dissipator and base plate connector, act as the caulk material between the heat source and heat dissipator. |
| STG-50D | grey | 5.0W/mK Thermal grease | Heat dissipator and base plate connector, act as the caulk material between the heat source and heat dissipator. |
| P/N | Color | Mixing ratio | Mixed viscosity (cps,25℃) | Thermal conductivity | Features and Applications. |
|---|---|---|---|---|---|
| SFR-925D | pink | 1:1 | 6,000 | 2.2W/mK Thermal potting gap filler | It is used when potting requires high heat conduction. |
| SFR-935D | pink | 1:1 | 23,000 | 3.2W/mK Thermal potting gap filler | It is used when potting requires high heat conduction. |
| P/N | Color | Thermal conductivity | Features and Applications. |
|---|---|---|---|
| SFR-3101HW | white | 1.6W/mK Fixing glue | High heat conduction, good mechanical strength and adhesive Strength fixed sealants. |
| SFR-3109 | white | 2.0W/mK Fixing glue | High heat conduction, good mechanical strength and adhesive Strength fixed sealants. |
| P/N | Color | Mixing ratio | Thermal conductivity | Features and Applications. |
|---|---|---|---|---|
| SC-T20 | blue | 1:1 | 2.0W/mK Thermal gel | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| SC-T30 | blue | 1:1 | 3.0W/mK Thermal gel | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| SC-T40 | blue | 1:1 | 4.0W/mK Thermal gel | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| P/N | Color | Thermal conductivity | Features and Applications. |
|---|---|---|---|
| FYG-1220 | grey | 2.0W/mK Thermal putty | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| FYG-1230 | grey | 3.0W/mK Thermal putty | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| FYG-1240 | grey | 4.0W/mK Thermal putty | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| FYG-1250 | grey | 5.0W/mK Thermal putty | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
| FYG-1260 | grey | 6.0W/mK Thermal putty | Heat dissipator, base plate connecting, 5G communication, new energy and battery pack, act as the caulk material between the heat source and heat dissipator. |
台灣新北市樹林區中正路216-2號2樓
2F. No.216-2, Zhongzheng Rd., Shulin Dist., New Taipei City 238, Taiwan (R.O.C.)
Email:
fongyong@fongyong.com.tw
Phone: 886-2-2682-4939
Fax: 886-2-2683-4333
